TECH HUB | 高速互聯與先進封裝整合 High-Speed Interconnect & Advanced Packaging

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High-Speed Interconnect &
Advanced Packaging

High-Speed Interconnect & Advanced Packaging

16

Double Side RDL With Dynamic Routing Technology For CoPoS Application

18

MicroLED Optical Transceiver Module

19-2

Fan-Out Wafer Level Packaging Shuttle Service Platform

22

FOUP TYPE EUV WAFER METER

25

Advanced Sensor Chip: Microstructure Process & High-Vacuum Packaging Technology

28

Production-Grade 12-inch ALD Equipment for High Aspect Ratio (AR > 50) Semiconductor Manufacturing

17

1.6 Tbps Optical Engine/Transceiver

19

Wafer-Level Low-Warpage Fan-Out Optoelectronic Integration Platform

20

AI-Driven Die Shift Design in Panel-Level Packaging

23

Real-Time Microparticle Counting System for Semiconductor Wet Processes

26

Semiconductor Wafer 3D Metrology and Internal Transmissive Optical Inspection Technology

29

High-Precision Lens Manufacturing Technology

17-1

Detachable Fiber Array Unit

19-1

Pluggable Optical Fiber Array Coupling Module

21

Multiscale Stress Metrology for Through-Glass Via (TGV)

24

Next-Generation Panel-Level Packaging Metallization Technology

27

Sub-Nanometer Advanced Packaging Metrology System

High-Speed Interconnect &

Advanced Packaging

High-Speed Interconnect &

Advanced Packaging

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High-Speed Interconnect &
Advanced Packaging

High-Speed Interconnect & Advanced Packaging

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AI Computing &
System Architecture

System Architecture

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High-Efficiency
Applications

High-Efficiency

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