High-Speed Interconnect &
Advanced Packaging
High-Speed Interconnect & Advanced Packaging
Production-Grade 12-inch ALD Equipment for High Aspect Ratio (AR > 50) Semiconductor Manufacturing
Develop a horizontal/vertical cross-flow ALD technology for high-throughput deposition of high aspect ratio (AR > 50) structures, achieving up to a threefold increase in deposition rate while supporting versatile multi-material deposition.
This project focuses on the development of a high-volume manufacturing 12-inch single-wafer Atomic Layer Deposition (ALD) system. The system is designed to address the stringent process requirements of high-aspect-ratio structures for AI, High-Performance Computing (HPC), High Bandwidth Memory (HBM), 3D NAND, and advanced packaging applications. It aims to establish a comprehensive high-throughput, high-uniformity, and high Aspect Ratio (AR > 50) thin-film deposition solution. The proposed system is expected to significantly improve film uniformity, deposition rate, and equipment throughput while reducing process development costs. In addition, it will establish indigenous core technologies for advanced ALD equipment, strengthening Taiwan's domestic semiconductor equipment, materials, and component supply chain, and enhancing its competitiveness in the global market for advanced semiconductor manufacturing equipment.
