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High-Speed Interconnect &
Advanced Packaging
High-Speed Interconnect & Advanced Packaging


Sub-Nanometer Advanced Packaging Metrology System
low-coherence interferometry for reconstructing nanometer-level 3D surface profiles
The white light interferometer module uses low-coherence interferometry, where a broadband light source illuminates the sample and interference fringe phase and intensity are analyzed to obtain nanometer-level 3D surface profiles and height information. Featuring non-contact, high-precision, and fast measurement, it is ideal for wafer topography, and roughness measurement。

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