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High-Speed Interconnect &
Advanced Packaging
High-Speed Interconnect & Advanced Packaging
Wafer-Level Low-Warpage Fan-Out Optoelectronic Integration Platform
3D optoelectronic integration, high-precision array optical coupling, and package validation
3D Optoelectronic Integration, High-Precision Array Optical Coupling, and Package Validation，
ITRI develop Wafer-level low-warpage fan-out EIC-to-PIC integration with short-reach reconstituted packaging, enabling >400 Gbps/lane CPO applications via 150°C Cu/polymer hybrid bonding and <1 μm alignment accuracy.
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