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High-Speed Interconnect &
Advanced Packaging
High-Speed Interconnect & Advanced Packaging
MicroLED Optical Transceiver Module
High-density MicroLED optical interconnect technology that overcomes the limitations of conventional copper interconnects.
By integrating high-density MicroLED light sources and micro-PD sensing array units with fiber bundles, this technology forms a high-efficiency short-reach optical interconnect module. It enables Tbps-class data transmission between chips and across boards, with energy consumption below 1 pJ/bit. The technology overcomes the limitations of conventional copper interconnect architectures and supports applications such as AI accelerators, GPU modules, and edge computing.
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