Double Side RDL With Dynamic Routing Technology For CoPoS Application

To meet the future demands of high-speed computing, we have developed a low-warpage, high-resolution panel-level packaging double-sided RDL technology. Based on the existing single-sided process flow of packaging and panel manufacturers, we have developed a large-size low-warpage double-sided RDL structure (31  ×  31 cm2) and introduced a panel-level copper pillar process to electrically connect the upper and lower RDL layers. In addition, high-resolution maskless circuit patterning technology (1.5μm) can also be used for die shift compensation in the redistribution layer (RDL) of the future panel-level interposer.