High-Speed Interconnect &
Advanced Packaging
High-Speed Interconnect & Advanced Packaging


Pluggable Optical Fiber Array Coupling Module
3D optoelectronic integration, high-precision array optical coupling, and package validation
With the explosive growth in demand from AI and cloud computing, data transmission volumes are increasing exponentially. To meet the massive computing demands of chips, a research team has developed a "pluggable" fiber optic connection device, essentially equipping expensive chips with "optical slots," enabling them to transmit data at higher speeds using light. This also allows for manual plugging and unplugging and replacement of the fiber optic cables, significantly addressing the pain point of difficult repair after damage to traditional equipment.
The device consists of a base fixed to the chip and an upper component that holds the fiber optic array. Through special flexible clips and positioning pins, along with internal microlenses to improve accuracy, the device aligns precisely like Lego bricks, ensuring efficient optical signal transmission. Experiments show low loss variation after multiple plugging and unplugging cycles, stable optical quality, and compliance with industry standards. This not only reduces the risk of rendering the entire module unusable due to partial damage but also provides AI servers with a low-cost, high-efficiency, and reliable optical connection solution.


