Advanced Sensor Chip: Microstructure Process & High-Vacuum Packaging Technology

ITRI has established the Sensing Microstructure Process Integration and High-Vacuum Wafer Packaging Platform, providing a comprehensive 8-inch pilot production environment for advanced sensor devices. The platform integrates lithography, thin-film deposition, dry and wet etching, wafer bonding, wafer-level packaging (WLP), and high-vacuum packaging into a one-stop development service from device design to pilot manufacturing.

By combining getter technology with mTorr-level wafer vacuum packaging, the platform significantly improves the sensitivity, reliability, and long-term stability of infrared sensors, MEMS, and inertial sensing devices. It also supports advanced process integration for Metalens, Co-Packaged Optics (CPO), and next-generation sensing technologies.

Through strategic collaborations with SAES, Preciseley, and Nikon, ITRI provides a complete process development and validation platform that helps industry partners accelerate product commercialization, reduce development risks, and strengthen the competitiveness of Taiwan's advanced semiconductor and sensing ecosystem.