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High-Speed Interconnect &
Advanced Packaging
High-Speed Interconnect & Advanced Packaging
Next-Generation Panel-Level Packaging Metallization Technology
Fully wet-process TGV metallization — a low-cost, production-ready solution for high-aspect-ratio ( AR 5 – 20 ) through-glass vias
The fully wet-process TGV metallization technology integrates fully wet-process seed layer deposition with single-additive electroplating to overcome the copper-filling bottleneck of high-aspect-ratio (AR 5–20) through-glass vias. It achieves void-free copper filling with a copper adhesion strength exceeding 8 N/cm, and supports mass production on 8–12 inch wafers as well as panel-level glass substrates of 310 × 310 mm and 510 × 515 mm, providing a low-cost, highly reliable solution for advanced packaging.
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