High-Speed Interconnect &
Advanced Packaging
High-Speed Interconnect & Advanced Packaging
Real-Time Microparticle Counting System for Semiconductor Wet Processes
Overcoming dynamic interference from bath color and microbubbles
One-stop integration of particle counting and wet cleaning equipment
Overcomes dynamic bath color interference and directly captures raw sensor signals to monitor microparticle concentration changes (1–5 µm) within the tank. It is highly adaptable to various wet process production lines, including electroplating, electroless plating, and cleaning.
The one-stop integration of the particle counting sensor module and cleaning equipment enables real-time online smart control (e.g., motors, ultrasonics, water temperature) and predictive maintenance strategies (consumable replacement). This shortens response times for anomaly alerts and significantly reduces waste.
