Multiscale Stress Metrology for Through-Glass Via (TGV)

Multiscale Stress Metrology for Through-Glass Via (TGV) is developed to characterize residual stress distributions in advanced packaging glass substrates through high-resolution, non-destructive stress imaging and quantitative analysis. Multiscale evaluation of TGV structures is enabled by the platform, and critical insights into stress concentration, structural integrity, and potential reliability issues during manufacturing and process development are provided. The system is validated in accordance with ISO 5725 measurement validation standards. A measurement precision of 0.1 nm, an accuracy of 95%, and a repeatability of 95% are achieved. With a 20 ×  optical magnification, a spatial resolution of 0.35 μm/pixel is provided, making the system suitable for the detailed characterization of TGV structures with a substrate thickness of 500 μm, a via diameter of 50 μm, an aspect ratio of 10, and a via pitch of 150 μm. Glass substrates ranging from 50  ×  50 mm² to 310  ×  310 mm² are supported, allowing both laboratory-scale research and industrial manufacturing requirements to be accommodated. By integrating multiscale physical stress imaging with quantitative analysis, valuable verification capabilities are provided for IC designers, advanced packaging manufacturers, material suppliers, and equipment vendors. Process optimization, material evaluation, equipment validation, and reliability assessment are facilitated. Technology development is accelerated, while development risks are reduced and product quality is improved. Multiscale Stress Metrology for TGV is particularly well suited for next-generation glass-based advanced packaging and heterogeneous integration applications.