High-Efficiency
Applications
High-Efficiency Applications
High-Frequency GaN-on-Si Technology and System Verification Platform
The high-speed engine for next-gen communications: A GaN-on-Si verification platform for faster, more efficient, and compact 6G components.
Targeting the requirements for long-distance, high-frequency, and high-capacity data transmission in next-generation communications, the "High-Frequency GaN-on-Si Technology and System Verification Platform" features three major highlights:
1. Higher Frequency & Lower Cost: By utilizing an 8-inch wafer process, the maximum operating frequency of the components reaches 325 GHz. This can be applied to 100 GHz transmission systems, delivering significantly wider transmission bandwidth and faster data rates.
2. Higher Efficiency: The power amplifier (PA) efficiency is boosted by 70% compared to leading global competitors. This energy-saving and low-heat performance directly reduces system cooling costs.
3. More Compact Form Factor: Featuring a world-first packaging innovation, the platform integrates "multi-chip + antenna + thermal dissipation" into a single module. This highly integrated module can easily fit into devices like smartphones and automotive rearview mirrors for satellite communications.
By developing high-frequency transmission modules, this platform has accumulated comprehensive, full-process know-how—spanning upstream epitaxy, device fabrication, packaging, modules, to end-user systems—greatly enhancing the autonomy of key technologies. To date, the platform has transferred technologies to or collaborated with over 60 manufacturers, assisting Taiwan in establishing its own next-generation communication core components and strengthening its competitive edge in the 6G and satellite communication era.
