Glass Substrate Phased Array Antenna Technology

This technology is based on panel-level processing and integrates thick-copper processes to develop a high-gain, high-radiation-efficiency phased array antenna. Unlike conventional phased array architectures that rely on beamforming integrated circuits (BFICs), the proposed design eliminates the use of BFICs by employing low-cost PIN diode switching elements together with a proprietary switch-based phased-array beam steering algorithm. This approach enables electronic beam steering while significantly reducing system cost, power consumption, and design complexity. The antenna is fabricated on a glass substrate, providing low dielectric loss, excellent dimensional stability, and compatibility with large-area manufacturing. PIN diode components are assembled onto the glass substrate using chip-bonding technology, enabling a modular architecture with enhanced assembly flexibility. Furthermore, a thick-copper metallization process is adopted to reduce conductor loss, thereby improving antenna radiation efficiency and power-handling capability for Ku- and Ka-band applications. The proposed panel-level phased array antenna offers low cost, large-area scalability, high reliability, and mass-production capability, enabling broad applications in next-generation communications, phased-array radar, and related systems.