Power Supplies Oriented GaN-based Solutions

This exhibit is built around Taiwan-made 650 V enhancement-mode GaN power chips combined with wire-bond-free packaging and low-parasitic interconnect design. The package warpage, electrical parasitics, and thermal path are modeled and optimized to support high-frequency operation. The solution has been validated in a 5.5 kW PSU and targets AI servers, HPC platforms, and high-power-density supply systems.