Large Cold Plate Heat Dissipation Technology

Large-Scale Cold Plate Cooling Technology is an advanced liquid cooling solution specifically developed to address the challenges of multi-chip, high-density AI servers. Traditional solutions typically employ multiple independent cold plates per chip, resulting in a large number of internal pipes and complex piping, significantly increasing the risk of leakage and maintenance complexity. The core advantage of this new technology lies in its innovative design of a large, zoned cold plate. Through topology optimization and precise micro/nano channel layout, combined with a 3D heat transfer structure, it successfully integrates multiple independent cold plates into a single, large, integrated cold plate. This architecture simultaneously addresses the cooling needs of multiple heat sources within the server, significantly simplifying the external piping structure. Taking a practical configuration as an example, the system can be improved from the previous complex "one-to-one heat source cold plate (A total of four cold plates are required,8 inlet/outlet ports)" to "one-to-four heat source cold plate", requiring only 2 inlet/outlet ports in total. This highly integrated design not only achieves the ultimate flow channel connection and uniform heat dissipation within the limited space of the server, but also significantly reduces the risk of leakage due to the significant reduction in the number of pipes, greatly improving the safety and reliability of next-generation AI server maintenance.